Ricerca
Italiano
  • English
  • 正體中文
  • 简体中文
  • Deutsch
  • Español
  • Français
  • Magyar
  • 日本語
  • 한국어
  • Монгол хэл
  • Âu Lạc
  • български
  • Bahasa Melayu
  • فارسی
  • Português
  • Română
  • Bahasa Indonesia
  • ไทย
  • العربية
  • Čeština
  • ਪੰਜਾਬੀ
  • Русский
  • తెలుగు లిపి
  • हिन्दी
  • Polski
  • Italiano
  • Wikang Tagalog
  • Українська Мова
  • Altri
  • English
  • 正體中文
  • 简体中文
  • Deutsch
  • Español
  • Français
  • Magyar
  • 日本語
  • 한국어
  • Монгол хэл
  • Âu Lạc
  • български
  • Bahasa Melayu
  • فارسی
  • Português
  • Română
  • Bahasa Indonesia
  • ไทย
  • العربية
  • Čeština
  • ਪੰਜਾਬੀ
  • Русский
  • తెలుగు లిపి
  • हिन्दी
  • Polski
  • Italiano
  • Wikang Tagalog
  • Українська Мова
  • Altri
Title
Transcript
Successivo
 

Transcending the Limits of Microchip Fabrication:Extreme UV Lithography, Part 2 of 2

Dettagli
Scarica Docx
Leggi di più
In the coming years, the application of microchips will continue to expand, the demand for chips will also continue to grow. However, the traditional 193 nm lithography has reached its limit and must be replaced with its 13.5 nm EUV counterpart. It is generally agreed that EUV lithography is the most difficult technology to perfect in the history of the semiconductor industry — so challenging that it is comparable to NASA’s Moon landing project.
Guarda di più
Tutte le parti  (2/2)
Condividi
Condividi con
Incorpora
Tempo di inizio
Scarica
Mobile
Mobile
iPhone
Android
Guarda nel browser mobile
GO
GO
Prompt
OK
App
Scansiona il codice QR
o scegli l’opzione per scaricare
iPhone
Android